The Physics of Microdroplets

The Physics of Microdroplets gives the reader the theoretical and numerical tools to understand, explain, calculate, and predict the often nonintuitive observed behavior of droplets in microsystems.

Microdrops and interfaces are now a common feature in most fluidic microsystems, from biology, to biotechnology, materials science, 3D-microelectronics, optofluidics, and mechatronics. On the other hand, the behavior of droplets and interfaces in today's microsystems is complicated and involves complex 3D geometrical considerations. From a numerical standpoint, the treatment of interfaces separating different immiscible phases is difficult.

After a chapter dedicated to the general theory of wetting, this practical book successively details:

• The theory of 3D liquid interfaces
• The formulas for volume and surface of sessile and pancake droplets
• The behavior of sessile droplets
• The behavior of droplets between tapered plates and in wedges
• The behavior of droplets in microchannels
• The effect of capillarity with the analysis of capillary rise
• The onset of spontaneous capillary flow in open microfluidic systems
• The interaction between droplets, like engulfment

• The theory and application of electrowetting

• The state of the art for the approach of 3D-microelectronics using capillary alignment

Content:
Chapter 1 Fundamentals of Capillarity (pages 5–64):
Chapter 2 Minimal Energy and Stability Rubrics (pages 65–82):
Chapter 3 Droplets: Shape, Surface and Volume (pages 83–103):
Chapter 4 Sessile Droplets (pages 105–142):
Chapter 5 Droplets Between Two Non?parallel Planes: From Tapered Planes to Wedges (pages 143–160):
Chapter 6 Microdrops in Microchannels and Microchambers (pages 161–181):
Chapter 7 Capillary Effects: Capillary Rise, Capillary Pumping, and Capillary Valve (pages 183–208):
Chapter 8 Open Microfluidics (pages 209–250):
Chapter 9 Droplets, Particles and Interfaces (pages 251–292):
Chapter 10 Digital Microfluidics (pages 293–339):
Chapter 11 Capillary Self?assembly for 3D Microelectronics (pages 341–363):
Chapter 12 Epilogue (pages 365–366):