Three-Dimensional Integration of Semiconductors:...

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Three-Dimensional Integration of...

Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications

Name: Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications
ISBN: 9783319186757

Kazuo Kondo, Morihiro Kada, Kenji Takahashi (eds.)

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This book starts with background concerning three-dimensional integration - including their low energy consumption and high speed image processing - and then proceeds to how to construct them and which materials to use in particular situations. The book covers numerous applications, including next generation smart phones, driving assistance systems, capsule endoscopes, homing missiles, and many others. The book concludes with recent progress and developments in three dimensional packaging, as well as future prospects.

种类:

Technique - Electronics: VLSI

年:

2015

出版:

出版社:

Springer International Publishing

语言:

english

ISBN 10:

3319186752

ISBN 13: