Copper Electrodeposition for Nanofabrication of Electronics Devices
Masayuki Yokoi (auth.), Kazuo Kondo, Rohan N. Akolkar, Dale P. Barkey, Masayuki Yokoi (eds.)This book discusses the scientific mechanism of copper electrodeposition and it's wide range of applications. The book will cover everything from the basic fundamentals to practical applications. In addition, the book will also cover important topics such as:
• ULSI wiring material based upon copper nanowiring
• Printed circuit boards
• Stacked semiconductors
• Through Silicon Via
• Smooth copper foil for Lithium-Ion battery electrodes
This book is ideal for nanotechnologists, industry professionals, and practitioners.
种类:
年:
2014
出版社:
Springer New York
语言:
english
页:
279
ISBN 10:
1461491762
ISBN 13:
9781461491767
系列:
Nanostructure Science and Technology
文件:
PDF, 11.53 MB
IPFS:
,
english, 2014